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Ships within 48 hours · Estimated delivery Oct 25 - Oct 30
combined with dual-channel ECC memory feature
Intel TCC and TSN technologies
and header for SMBUs/I2C
IPMI featured Prototype Kit with AMD Embedded Ryzen V3000 in COM Express Basic Size Type 7 form factor offers best Performance/Watt in CPU computing and better remote/local manageability
THSF-ALT-BL-S heatsink with fan
I-Pi SMARC Elkhart Lake COM Express combined with dual-channel ECC memoryPRODUCT INFORMATION IoT Prototype Kit based on Intel Elkhart Lake BOX INCLUDING: I Pi SMARC Elkhart Lake assembly consisting of I Pi SMARC Plus carrier LEC EL SMARC module with Intel 6th Gen. Atom x6425E quad core SoC (Elkhart Lake) 4GB soldered memory 64GB eMMC 110 220 VAC to 19VDC adapter with US EU power cord SPECIFICATIONS: Intel 6th Gen. Atom x6425E quad core SoC with Intel UHD integrated graphics, Intel Boot Guard, Intel OS Guard, Intel PTT, and
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